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Chapter 4: Transistor Process, FinFET, and GAAFET

From planar MOSFETs to fins and nanosheets

Why transistor structures changed

Planar MOSFETs face leakage, short-channel effects, and threshold-control problems as they shrink. FinFETs improve gate control by wrapping the gate around vertical fin sidewalls. GAAFET / nanosheet structures go further by surrounding stacked nanosheet channels, improving electrostatic control and design flexibility.

Process challenges

FinFET and GAAFET flows require more complex selective etching, epitaxy, stress engineering, high-k metal gates, spacers, and source/drain contacts. The more 3D the structure becomes, the harder morphology control gets. Nanometer-level shifts can change drive current, leakage, and threshold distribution.

Why GPUs care

A GPU repeats tens of billions of transistors across huge parallel arrays. Transistor density, switching speed, leakage, and operating voltage affect compute-unit count, clock speed, power, and thermals. Whether an advanced GPU can add compute within a power envelope starts with transistor-level efficiency.

References

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